• Polyamide hot melt adhesive resin
Polyamide hot melt adhesive resin
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Polyamide hot melt adhesive resin

Hot melt adhesive is prepared from dimer acid polyamide resin and multiple amine throughhightemperature reaction.t is soluble in common organic solvents. lts viscosity whenheated melting is greatlyrelevant to temperature .

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  • Product Description
  • PROPERTIES

    1.Yellowish granular transparent solid and good flow performance;

    2.Excellent viscosity and strong cohesive force.

    SPECIFICATION

     

    Type

     

     

    Quality index

    Color

    (Fe-Co)

    Viscosity

    (Mpa.s/25℃)

    Acid value

    (mgKOH/g)

    Amine value

    (mgKOH/g)

    Softening point℃

    WD-01

    ≤7#

    150~250

    ≤6

    ≤5

    110±5

    WD-02

    ≤7#

    250~350

    ≤6

    ≤5

    108±5

     

    APPLICATION

    1.Hot melt adhesive as seal material in electronic components, decoration in automobile.
    2.Hot melt adhesive of shoes, fabric, wood, plastic, metal and ceramic.

    PACKING AND STORAGE

    Paper bag,25kg/bag. store in a cool and dry place keep away from direct sunlight

Polyamide hot melt adhesive resin

Hot melt adhesive is prepared from dimer acid polyamide resin and multiple amine throughhightemperature reaction.t is soluble in common organic solvents. lts viscosity whenheated melting is greatlyrelevant to temperature .

Phone/WhatsApp:

Still deciding? Get samples first,  Contact US !

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